Blaize, the AI computing innovator revolutionizing edge computing solutions, announced it has raised $106 million from existing investors, including Bess Ventures, Franklin Templeton, DENSO, Mercedes Benz, and Temasek and new investors Rizvi Traverse, Ava Investors and BurTech LP LLC.
Blaize provides full-stack AI-enabled computing solutions across diverse and expanding markets,...
Rambus Inc., a premier chip and silicon IP provider making data faster and safer, announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), including an industry-leading extreme current device for high-performance applications. With this new family of server PMICs, Rambus offers module manufacturers...
Aetina, a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany. This groundbreaking product is a small form factor PCIe graphics card powered by the high-performance Intel Arc A380E GPU.
Unmatched Power in a Compact Design
The Aetina IA380E-QUFL delivers workstation-level performance packed into a low-profile,...
Lenovo Group announced a comprehensive new suite of purpose-built AI-centric infrastructure systems and solutions to advance Hybrid AI innovation from edge to cloud. Lenovo is delivering GPU-rich and thermal efficient solutions intended for compute intensive workloads across multiple environments and industries. In industries such as financial services and healthcare,...
Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology
Synopsys, Inc. announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs. Among...
Collaboration on prototype design and mass product development with Samsung Foundry's 4nm process technology
SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a collaboration with MetisX to develop a Compute Express Link (CXL)-based memory accelerator chip. The aim of this collaboration is to...
By joining forces with industry leaders in the Arm Total Design ecosystem, Kalray is helping more companies integrate its AI and data-processing solution into their next-generation chips.
Kalray, a leading provider of hardware and software solutions to accelerate data intensive workflows from Cloud to Edge, announced that it has extended...
SK hynix Inc. announced that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family,...
Intel Foundry reported a key milestone in advanced semiconductor manufacturing with completed assembly of the industry’s first commercial High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography scanner, located at the company’s Hillsboro, Oregon, R&D site. Intel’s TWINSCAN EXE:5000 High NA EUV tool from lithography leader ASML is now...
Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024.
DEEPX, an on-device AI semiconductor company, is announcing plans to expand its first-generation AI chip lineup...
