Supermicro, Inc. serves as a full-service IT provider for AI/ML, HPC, cloud, storage and 5G/edge. The solutions provider has added new systems with the...
Cadence Design Systems, Inc. announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs....
Crusoe Energy Systems LLC announced that it has collaborated with VAST Data to offer Crusoe Cloud customers Shared Disks, a new high performance storage product for AI,...
New Cloud GPU offering unlocks enterprise agility, performance, and cost-efficiency for global scaling of AI-native applications with AMD Instinct™ MI300X
Vultr, the world’s largest privately...
Optimized EDA and IP Solutions Deliver Enhanced Compute Performance, Power and Engineering Productivity for TSMC N2 and A16 Processes
Synopsys, Inc. announced its continued, close collaboration...
Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and...