In a bid to reshape the landscape of high-performance computing, Samsung Electronics has officially entered into a Memorandum of Understanding (MOU) with AMD. The move represents a major extension of the companies’ longstanding strategic relationship, which has primarily involved the joint development and supply of state-of-the-art AI memory and computing architectures.
The collaboration was formalized during a high-profile signing ceremony at Samsung’s premier semiconductor fabrication facility in Pyeongtaek. The event was led by Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics, and Dr. Lisa Su, Chair and CEO of AMD.
“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”
Engineering the Future of AI Infrastructure
The heart of this expanded partnership lies in the integration of Samsung’s revolutionary HBM4 technology with AMD’s next-generation AI accelerators. Under the new terms, Samsung will serve as a primary provider of HBM4 for the AMD Instinct™ MI455X GPU. Additionally, the companies will align on advanced DRAM solutions tailored for the upcoming 6th Gen AMD EPYC™ CPUs, currently codenamed “Venice.”
These technical milestones are set to become the backbone of the AMD Helios platform—a rack-scale architecture engineered to meet the massive computational demands of modern AI model training and large-scale inference.
“Powering the next generation of AI infrastructure requires deep collaboration across the industry,” said Dr. Lisa Su, Chair and CEO of AMD. “We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”
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Technical Benchmarks and Market Impact
Samsungs HBM4 is a showcase of what is possible with semiconductor engineering. This memory technology uses 6th-generation 10-nanometer-class DRAM process technology (1c) coupled with a 4nm logic base die paving the way for a new era of data transfer speeds up to 13 gigabits-per-second (Gbps). Apart from memory, the collaboration goes to high performing DDR5 being optimized for the AMD Helios ecosystem. In addition, the two organizations are discussing a potential foundry partnership wherein Samsung would be providing advanced manufacturing services for AMDs new product roadmap.
A Legacy of Innovation
The alliance builds upon nearly twenty years of joint innovation across the graphics, mobile, and computing sectors. Recently, Samsung acted as the primary HBM3E partner for AMD, providing the essential memory bandwidth for the Instinct MI350X and MI355X series. This latest MOU ensures that both companies remain at the forefront of the “AI Era,” delivering the scalability and speed required for the world’s most complex digital workloads.
