Tuesday, June 9, 2026

Siemens and Infineon Unite to Revolutionize Electrical Protection in Data Centers and Industrial Facilities via Silicon Carbide Technology

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Technical collaboration between Infineon Technologies AG and Siemens AG is geared towards developing an updated electrical protection system and ensuring the maintenance of uptime in artificial intelligence (AI) data centers, automated production plants, and battery energy storage systems (BESS) in industry. The technical collaboration involves Siemens using the specific SiC power modules provided by Infineon in the manufacture of the innovative circuit breakers under the brand name SENTRON 3QD2, resulting in significant improvements in the heat dissipation capabilities, lifetime, and power density of the circuit breakers.

Overcoming the Vulnerabilities of Complex, Electrified Infrastructure

Due to the rise in the number of densely packed AI data centers and advanced industrial automation systems, the technical challenge of electrical power distribution has become more complex. The changing scenario leads to a higher risk of electrical failure, thus increasing the need for a sustainable and responsive system of electrical fault isolation.
Known as a solid-state circuit breaker, the semiconductor circuit breaker combines solid-state electrical devices with intelligent algorithms that provide electrical isolation due to overload or short circuit in the system. Electromagnetic circuit breakers function by employing moving parts which make the process slow. On the other hand, the Siemens SENTRON 3QD2 circuit breaker employs semiconductor technologies to achieve electrical isolation in the microseconds.

Running at up to 1,000 times quicker than any normal mechanical solution, this speed of performance is essential for DC microgrids. It avoids any minor electrical issues developing into full-blown disasters, data corruption, or costly asset damage in situations that could mean substantial economic losses in terms of unscheduled downtime.

Also Read: NVIDIA and SK hynix Establish Multiyear Strategic Alliance to Engineer Next-Generation Memory for AI Factories

Engineering Breakthrough: Integrating CoolSiC™ Modules into Advanced Infrastructure
The industrial collaboration targets the extreme operational requirements of modern power systems where speed, precise tripping mechanisms, and long-term durability are non-negotiable. By embedding Infineon’s 62 mm CoolSiC™ 1200 V MOSFET module into Siemens’ proprietary electrical protection framework, the two technology companies are actively building more resilient, efficient, and future-proof power distribution networks. This shared development pipeline supports the accelerating transition toward industrial DC grids, allowing infrastructure operators to navigate rising performance thresholds safely.
A functional exhibition showcase of the Siemens SENTRON 3QD2 semiconductor circuit breaker will be presented at the Infineon exhibition pavilion (Hall 7, Booth 470) during the upcoming PCIM Europe trade exposition in Nuremberg.

Executive Perspectives & Commentary

“AI data centers and factories are becoming increasingly electrified and complex. This increases vulnerability to electrical failures and drives the demand for more sustainable, efficient and reliable power distribution systems,” said Andreas Weisl, Executive Vice President & Chief Sales Officer of Industrial and Infrastructure at Infineon. “By combining our advanced silicon carbide technology with Siemens’ expertise in power distribution, we are addressing this demand to ensure fast, safe and reliable operations in power-critical environments.”

“Our new direct current portfolio offers innovative solutions that not only improve energy efficiency but also enable the development of resilient, future-proof infrastructure,” said Markus Grabmeier, CEO Electrical Products at Siemens Smart Infrastructure. “Direct current applications can decrease energy consumption and substantially cut material usage. By integrating batteries, peak power can also be significantly reduced. With this approach, we are making a decisive contribution to the decarbonization of our industries, while reinforcing our commitment to developing technologies that deliver tangible value to our customers and society.”

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