Intel Corporation has achieved a revolutionary milestone in integrated photonics technology for high-speed data transmission. At the Optical Fiber Communication Conference (OFC) 2024, Intel’s Integrated Photonics Solutions (IPS) Group demonstrated the industry’s most advanced and first-ever fully integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU and running...
Altair, a global leader in computational intelligence, is thrilled to welcome Devoteam as a new channel partner for the EMEA region. Within the partnership, Devoteam will offer Altair's leading data analytics and artificial intelligence (AI) solutions to its customers throughout the EMEA region.
"Partnering with Devoteam underscores our dedication to shaping the future of technology," said...
Cadence Design Systems, Inc. announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry. Furthering the companies’ collaboration on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, beginning with Intel 18A Cadence announced the availability of a complete Embedded Multi-die...
Synopsys, Inc. announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai™ EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge (EMIB) advanced packaging technology. The optimized reference flow provides a unified co-design and analysis solution, enabled by Synopsys 3DIC Compiler to accelerate exploration and development...
KAYTUS, a leading IT infrastructure provider announced the opening of the “Innovation Center” in Seoul. This center will enable Korean customers to explore cutting -edge compute solutions without the need for upfront infrastructure investment.
Located in Yeouido, the establishment of “KAYTUS Innovation Center” aims to meet the growing needs in...
Robust, chiplet-enabled platform based on Micron HBM3E supports best-in-class performance and exceptional power efficiency
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, announced a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform. Based on the company’s proven HBM3E IP, the...
Software and IP addresses system design complexity, performance, scalability and Time to Market of SoCs and chiplets for emerging applications.
Baya Systems emerged from stealth mode to announce its software-driven IP technology portfolio designed to accelerate sicomplexngle-die and multi-die SoC designs. These innovations bolster the emerging chiplet economy and enable...
Inspire Semiconductor Holdings Inc., a chip design company that provides revolutionary high-performance, energy-efficient accelerated computing solutions for High Performance Computing (HPC), AI, graph analytics, and other compute-intensive workloads, is pleased to announce the successful tapeout of its Thunderbird I Accelerated Computing chip for fabrication at TSMC.
Thunderbird I is InspireSemi’s...
Achronix Semiconductor Corporation, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, and Primemas, a fabless semiconductor company developing an innovative SoC Hub Chiplet (Hublet) platform using chiplet technology, announced a collaboration to bring FPGA programmability to the Primemas suite of products. Primemas chose the Speedcore™ eFPGA IP...
Hewlett Packard Enterprise announced a new AI enablement program, in collaboration with NVIDIA, designed to boost profitability and deliver new revenue streams for partners. The program offers new competencies and additional resources across AI, compute, storage, networking, hybrid cloud, sustainability, as well as enhanced HPE GreenLake offerings and capabilities.
HPE announced,...
