Computing

Computing

GigaIO and SourceCode Launch First Ever Suitcase-sized AI Supercomputer

Co-designed for portability and scalability, Gryf is airline cabin baggage-compliant and purpose-built for go-anywhere insights at the edge. GigaIO and SourceCode announced the launch of...

Computing

Red Hat Powers the Future of Supercomputing with Lawrence Livermore National Laboratory

Red Hat Enterprise Linux to serve as the foundation for El Capitan, the National Nuclear Security Administration’s first exascale supercomputer Red Hat, Inc., the world's...

Computing

BrainChip and Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities

BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of...

Cloud

CoreWeave Secures $1.1 Billion in Series C Funding to Drive the Next Generation of Cloud Computing for the Future of AI

CoreWeave, the leading specialized cloud provider for AI, announced it has secured $1.1 billion in new funding, led by Coatue, with participation from Magnetar who...

Computing

Blaize Secures $106 Million in Funding, Further Solidifying Blaize’s Leadership Position in Edge AI Computing

Blaize, the AI computing innovator revolutionizing edge computing solutions, announced it has raised $106 million from existing investors, including Bess Ventures, Franklin Templeton, DENSO,...

Computing

Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, announced the availability of its new family of state-of-the-art DDR5...

Computing

Aetina Accelerates Embedded AI with High-performance, Small Form-factor Aetina IA380E-QUFL Graphics Card

Aetina, a leading Edge AI solution provider, announced the launch of the Aetina IA380E-QUFL at Embedded World 2024 in Nuremberg, Germany. This groundbreaking product is a small form factor...

Computing

Lenovo Advances Hybrid AI Innovation to Meet the Demands of the Most Compute Intensive Workloads

Lenovo Group announced a comprehensive new suite of purpose-built AI-centric infrastructure systems and solutions to advance Hybrid AI innovation from edge to cloud. Lenovo...

Computing

Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes

Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology Synopsys, Inc. announced broad...

Computing

SEMIFIVE Collaborates with MetisX in Developing CXL-based Memory Accelerator Chip

Collaboration on prototype design and mass product development with Samsung Foundry's 4nm process technology SEMIFIVE, a leading design solution provider and pioneer of platform-based custom...

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