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Computing

SK hynix Partners with TSMC to Strengthen HBM Technological Leadership

SK hynix Inc. announced that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic...

Computing

With High NA EUV, Intel Foundry Opens New Frontier in Chipmaking

Intel Foundry reported a key milestone in advanced semiconductor manufacturing with completed assembly of the industry’s first commercial High Numerical Aperture (High NA) Extreme...

Analytics

DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets

Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this...

Computing

Advantech Establishes Collaboration with Qualcomm to Shape the Future of the Edge

Advantech proudly announced its strategic collaboration with Qualcomm Technologies, Inc. at Embedded World to revolutionize the edge computing landscape. This effort, combining AI expertise,...

Computing

The Future of AI Computing: Revolutionizing the World

In today's fast-paced world, artificial intelligence (AI) has become a driving force behind innovation and technological advancement. According to Statista, the AI market is...

Computing

Samsung Develops Industry’s Fastest 10.7Gbps LPDDR5X DRAM, Optimized for AI Applications

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, announced that it has developed the industry's first LPDDR5X DRAM supporting the industry’s...

Data Center and Co-location

Accelsius Unveils NeuCool With Unrivaled Thermal Performance for AI Data Centers

Patented two-phase direct-to-chip system cools beyond 1,500 watts per server chip, providing generational performance headroom driven by AI data center demand and high-performance...

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Tag: Computing

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