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Computing

Cadence and NVIDIA Deepen Alliance to Power AI-Driven Engineering Transformation

Cadence Design Systems and NVIDIA have expanded their strategic partnership to accelerate innovation in the era of artificial intelligence and high-performance computing, unveiling a...

Computing

Cadence’s Agentic AI: Engineering Workforce Multiplier in Chip Design

Cadence’s latest insights show how agentic AI is revolutionizing semiconductor design as a “workforce multiplier,” not a “workforce replacer,” by introducing the concept of...

Computing

Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification

Cadence announced its ChipStack TM AI Super Agent, which represents a major breakthrough in semiconductor design automation, as it begins shipping what is believed...

Computing

Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure

Lightmatter, the leader in photonic (super)computing, announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence’s silicon-proven, high-speed SerDes...

Computing

TSMC and Cadence Launch AI-Driven Design Flows and IP Solutions

Cadence Design Systems, Inc. announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs....

Computing

Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era

Cadence Design Systems, Inc. announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry. Furthering the companies’ collaboration on...

Data Center and Co-location

Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era

Cadence Design Systems, Inc. introduced the industry’s first comprehensive AI-driven digital twin solution to facilitate sustainable data center design and modernization, marking a significant...

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