Tuesday, November 5, 2024
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Intel Launches Xeon 6 & Gaudi 3: Next-Gen AI Solutions

As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment....

Blue Cheetah & LG Achieve Silicon Success in Chiplet Design

Blue Cheetah Analog Design and LG Electronics Inc. (LG) announced that they are collaborating and have demonstrated silicon success for a new generation of...

YES Delivers Multiple VeroTherm Formic Acid Reflow Systems To Leading Semiconductor Device Customers

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging applications, announced that it has delivered multiple VeroTherm Formic Acid...

Marvell Extends Connectivity Leadership With Industry’s First 1.6T PAM4 DSP for Active Electrical Cables

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, introduced the Marvell® Alaska® A 1.6T PAM4 DSP for active electrical cables (AECs), the industry's first...

AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise, Intel, Meta and Microsoft Form Ultra Accelerator Link (UALink) Promoter Group to Drive Data Center AI Connectivity

AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft announced they have aligned to develop a new industry standard dedicated to...

EnCharge AI Partners with Princeton University on Groundbreaking AI Chip Technology Supported By U.S. Department of Defense (DoD)

New collaboration to yield full-stack computing solution capable of supporting large-scale public- and private-sector advancements in AI through $18.6 million grant EnCharge AI, the company commercializing next-generation...

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