Tamar Product Family Includes Industry’s First Merchant 1.6T-2xFR4 and 800G-2xFR4 Products with Integrated Optical Multiplexer
DustPhotonics, a leading developer of silicon photonics solutions, announced Tamar200 and Tamar, two next-generation Photonic Integrated Circuits (PICs) that further extend the company’s merchant product leadership. Designed for AI workloads and hyperscale data center environments, the new 1.6T and 800G PICs enable breakthrough levels of performance, density, and power efficiency, and will be on display during a live demonstration at the OFC Trade Show in San Francisco, CA from April 1-3, 2025.
The Tamar200 is the industry’s first merchant 1.6T-2xFR4 PIC. The device supports two transmit channels of 800G-FR4, with each optical lane operating at 200Gb/s per lane, targeting next-generation 2xFR4 optical modules. Similarly, the Tamar PIC delivers two transmit channels of 400G-FR4 operating at 100Gb/s per lane.
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Both products include a low-loss athermal integrated multiplexer (mux) and DustPhotonics’ proprietary low-loss Mach-Zehnder Modulator (MZM) technology, eliminating the need for a Thermoelectric Cooler (TEC), and dramatically improving overall system efficiency. The products are designed for external lasers and require only 40mW class lasers per wavelength.
“We are excited to offer the first merchant 2xFR4 silicon photonics chip to the industry,” stated Yoel Chetrit, CTO of DustPhotonics. “We believe these products will play a significant role in relieving some of the ongoing EML (Electro-Absorbtion Modulated Laser) supply chain constraints in the industry.”
Both PICs are designed in a compact footprint ideal for OSFP and other high-density modules and can be used for fully retimed (DSP), Linear Pluggable Optics (LPO), and Linear Receive Optics (LRO) applications at reaches up to 2km.
Source: PRNewswire
