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Computing

Synopsys Partners with TSMC to Advance AI & Multi-Die Tech

Synopsys, announced its continued strategic collaboration with TSMC to advance multi-die solutions through cutting-edge EDA and IP products. These solutions support TSMC's leading-edge processes...

Computing

TSMC and Cadence Launch AI-Driven Design Flows and IP Solutions

Cadence Design Systems, Inc. announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs....

Computing

Synopsys & TSMC Enable Trillion-Transistor AI Chip Design

Optimized EDA and IP Solutions Deliver Enhanced Compute Performance, Power and Engineering Productivity for TSMC N2 and A16 Processes Synopsys, Inc. announced its continued, close collaboration...

Computing

TSMC & Ansys Boost 3D-IC Design with AI Integration

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and...

Computing

Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes

Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology Synopsys, Inc. announced broad...

Computing

SK hynix Partners with TSMC to Strengthen HBM Technological Leadership

SK hynix Inc. announced that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic...

Manufacturing

Part of the TSMC Open Innovation Platform® (OIP), the 3DFabric Alliance aims to accelerate 3D IC technology innovation

proteanTecs, a global leader of deep data analytics for advanced electronics, announced that the company has joined the TSMC Open Innovation Platform® (OIP) 3DFabric™...

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Tag: TSMC

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