Synopsys, announced its continued strategic collaboration with TSMC to advance multi-die solutions through cutting-edge EDA and IP products. These solutions support TSMC's leading-edge processes...
Optimized EDA and IP Solutions Deliver Enhanced Compute Performance, Power and Engineering Productivity for TSMC N2 and A16 Processes
Synopsys, Inc. announced its continued, close collaboration...
Complete Synopsys 40G UCIe IP Solution Delivers Maximum Bandwidth for Die-to-Die Connectivity in High-Performance AI Data Center Chips
Synopsys, Inc. announced the industry's first complete UCIe IP solution...
Synopsys, Inc. announced the availability of its production-ready multi-die reference flow, powered by Synopsys.ai™ EDA suite, and Synopsys IP for Intel Foundry's embedded multi-die interconnect bridge...
Production-Ready Design Flows, Multi-Die Solution, and Synopsys IP Deliver a Proven Path to Unparalleled Power and Performance for AI and HPC Designs
Synopsys, Inc. announced that its...
Synopsys, Inc. announced the industry's first complete PCIe 7.0 IP solution consisting of controller, IDE security module, PHY, and verification IP. This solution will enable chip makers...
Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology
Synopsys, Inc. announced broad...