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Data Center and Co-location

Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure

Ceva, Inc. a leading provider of silicon and software IP for the smart edge has teamed up with Microchip Technology Inc. In a long-term...
Computing

IGEL and Lenovo Announce Availability of AI-Ready Devices Pre-Loaded with IGEL OS

IGEL, provider of the secure endpoint OS for now and next, announced new developments resulting from its deepening partnership with Lenovo™. Through advanced collaboration...
Computing

Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design

Cadence Design Systems, Inc. unveiled its next-generation AI IP and software tools to address the escalating demand for on-device and edge AI processing. The...

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