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Lenovo Advances Hybrid AI Innovation to Meet the Demands of the Most Compute Intensive Workloads

Lenovo Group announced a comprehensive new suite of purpose-built AI-centric infrastructure systems and solutions to advance Hybrid AI innovation from edge to cloud. Lenovo...

Computing

Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes

Collaboration on AI-Driven Design Flows for Optimization and Productivity, Advancements in Photonic IC Integration, Plus Broad IP Development on TSMC 2nm Technology Synopsys, Inc. announced broad...

Computing

SEMIFIVE Collaborates with MetisX in Developing CXL-based Memory Accelerator Chip

Collaboration on prototype design and mass product development with Samsung Foundry's 4nm process technology SEMIFIVE, a leading design solution provider and pioneer of platform-based custom...

Computing

Kalray Joins Arm Total Design, Extending Collaboration With Arm on Accelerated AI Processing

By joining forces with industry leaders in the Arm Total Design ecosystem, Kalray is helping more companies integrate its AI and data-processing solution into...

Computing

SK hynix Partners with TSMC to Strengthen HBM Technological Leadership

SK hynix Inc. announced that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic...

Computing

With High NA EUV, Intel Foundry Opens New Frontier in Chipmaking

Intel Foundry reported a key milestone in advanced semiconductor manufacturing with completed assembly of the industry’s first commercial High Numerical Aperture (High NA) Extreme...

Analytics

DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets

Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this...

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Tag: Computing

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