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Computing

Synopsys Launches 40 Gbps IP for Fastest UCIe Designs

Complete Synopsys 40G UCIe IP Solution Delivers Maximum Bandwidth for Die-to-Die Connectivity in High-Performance AI Data Center Chips Synopsys, Inc. announced the industry's first complete UCIe IP solution...

Computing

Samsung Electro-Mechanics Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing

Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology Samsung Electro-Mechanics (SEMCO) announced a collaboration with AMD to supply high-performance...

Computing

Breakthrough Digital Lithography Technology From Applied Materials and Ushio to Enable More Powerful Computing Systems for the AI Era

Applied Materials, Inc. and Ushio, Inc. announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous integration (HI) of chiplets into 3D packages....

Computing

Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet

Tenstorrent, a company that sells AI processors and licenses AI and RISC-V IP, announced that it selected Samsung Foundry to bring Tenstorrent's next generation...

Computing

d-Matrix Announces $110 Million in Series B Funding to Make Generative AI Commercially Viable with First-of-Its-Kind Inference Compute Platform

d-Matrix, the leader in high-efficiency generative AI compute for data centers, has closed $110 million in a Series-B funding round led by Singapore-based global...

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