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Automation in AI

SnapLogic Leverages Amazon Bedrock to Make Anthropic’s model Claude Available in SnapGPT

SnapLogic, a leader in generative integration, announced it is working with Amazon Web Services (AWS) to expand the capabilities of SnapGPT, SnapLogic’s generative integration...
Customer Experience

Contentstack Announces Industry-First Amazon Bedrock Integration to Pioneer the Future of Digital Experiences

Contentstack, the leading Composable Digital Experience Platform (DXP) provider, announced the integration of Amazon Bedrock into Contentstack Automation Hub and AI Assistant. This strategic...
Cloud

Pinecone working with AWS to solve Generative AI hallucination challenges

Integration with Amazon Bedrock can help enterprises overcome greatest challenge in bringing reliable GenAI applications to market Pinecone, the vector database company providing long-term memory for...
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Round Up

AITech365’s Weekly Roundup: Discover the Most Recent News From Google Cloud, Thales, M42, Dataiku,...

AIT365 News Desk -
Here is AITech365’s Weekly Roundup of the top news from global markets. In this fast-paced world, breaking down information helps readers grasp the nuances...
Aerospike

Aerospike’s Network Efficiency Advantage for Rapidly Scaling Operational AI

AIT365 News Desk -
Aerospike, Inc., the real-time state, context, and decisioning platform for operational AI, expanded its network efficiency advantage for enterprises running AI inference workloads at...
Thales

Thales Enhances CipherTrust Data Security Posture Management to Secure Shadow Data and AI Pipelines

AiTech365 Bureau -
The corporate cybersecurity landscape around the world is undergoing a paradigm shift. With the advent of generative AI, multi-clouds, and SaaS systems, enterprise data...
Kong

Kong Unveils Kong Konnect an AI Connectivity Roadmap for Enterprise AI

AiTech365 Bureau -
Kong Inc. has unveiled its roadmap for Kong Konnect, its AI Connectivity Platform, at API + AI Summit, outlining capabilities designed to help enterprises...
Renesas

Renesas Unveils Dual-Side-Cooled 650V GaN Device to Advance 800V AI Data Center Power Architectures

AiTech365 Bureau -
Renesas Electronics Corporation has introduced the industry’s first 650V Gallium Nitride (GaN) power device featuring dual-side cooling (DSC). Engineered specifically for high-density power conversion...