Sunday, July 7, 2024

TYAN unveils its robust immersion cooling solution on the SC23, offering significant PUE (Power Usage Effectiveness) improvements.

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Tyan also showcased its complete lineup of the latest 4th generation Intel® Xeon® Scalable processor platforms Generation for HPC, AI and cloud computing applications.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, is unveiling an immersion cooling solution that delivers significant improvement in Power Usage Effectiveness (PUE) at SC23 in Booth #1917 ) and showcases its latest server platforms powered by Intel® XBee® Scalable processors and targeting HPC, AI and cloud computing applications.

Significant improvement in PUE in an immersion cooling tank compared to a traditional air cooling cabinet.

Launched live at the TYAN booth during SC23, the immersion cooling system is a 4U hybrid single-phase tank enclosure  equipped with four TYAN GC68A-B7136 cloud computing servers. Compared to a conventional air cooling cabinet, this hybrid immersion cooling system can provide a huge improvement in PUE, making it an ideal mission-critical solution for users targeting energy-saving and environmentally friendly products.

“TYAN strives to adopt the latest technologies and is committed to providing cutting-edge technology and environmentally friendly products,” said Eric Kuo , vice president of the Server Infrastructure Business Unit at MiTAC Computing Technology. “The best example is the immersion system presented at SC23 Cooling system. We are pleased that the TYAN product lines fit well and work perfectly in the immersion cooling system. TYAN will remain committed to collaborating with industry leaders and delivering best-in-class solutions tailored to the needs of our valued customers.”

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TYAN also showcases its full range of fourth-generation Intel Xeon Scalable processors, supporting platforms that meet the critical needs of HPC, cloud and AI applications.

With a target group of HPC and AI applications, TYAN presents its server barebones TYAN TD76-B5658, FT65T-B5652 , TS75A-B7132  as well as the server motherboards S5652 and S7130 . These products meet the requirements of heavy workload and high performance. Aiming to be present in cloud computing environments, TYAN also showcases its cloud platforms, including the GC68A-B7136 server barebone and S7136 server motherboards. For customers looking for embedded solutions, TYAN also shows its S5565 and S5567 integrated server motherboards that fit flexible and dense requirements.

As a subsidiary of MiTAC Computing Technology Corporation, TYAN also presents another cutting-edge product portfolio from Mitac Computing Technology, which was requested by Intel Data Center Solutions Group (DSG) in July this year. The Intel Server D50DNP family of products (known as Denali Pass) are server platforms with 4 compute nodes in a 2U chassis. The Intel Server M50FCP family of products (also known as Fox Creek Pass) are 2-socket server solutions in a 1U or 2U chassis. By combining Intel’s sophisticated technology and Intel’s high design quality, Mitac’s diverse product offering meets the diverse needs of the server industry.

SOURCE: PRNewswire

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