Qualcomm Technologies, Inc. is collaborating with Amazon for a multi-generational product program dedicated to scaling silicon that has been customized for high-performance AI data centers. The initiative involves the optimization of AI inference processing along with high-speed optical technologies required for the latest cloud networks.
The exponential growth of AI workloads within enterprises means that hyperscale data centers have increasingly greater requirements in terms of computing capacity, storage, networking and power usage. The initiative capitalizes on the strength of Amazon’s secure and cost-efficient AI platform, together with that of Qualcomm Technologies in the areas of low power architecture and semiconductor design.
Advancing Optical Connectivity and Chip Design Cycles
Beyond custom silicon, both organizations are collaborating on next-generation optical connectivity systems. Utilizing Qualcomm Technologies’ specialized SerDes and optical Digital Signal Processor (DSP) frameworks, the collaboration targets high-bandwidth interconnects capable of scaling up to 1.6T and beyond. These optical solutions are tailored to address the strict bandwidth requirements and operational scaling needs of next-generation AI environments.
Additionally, Qualcomm Technologies is expanding its internal deployment of Amazon Web Services (AWS) AI tools. By deploying solutions such as Amazon Bedrock for Electronic Design Automation (EDA) operations, Qualcomm Technologies aims to streamline its semiconductor engineering processes and shorten chip design cycles.
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“As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency,” said Cristiano Amon, President and CEO, Qualcomm Incorporated. “Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.”
“This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what’s possible,” said Prasad Kalyanaraman, Vice President, AWS. “By working together on customized silicon and advanced connectivity, we’re delivering more performant, efficient, and cost-effective infrastructure for our customers.”
