These were announced during the SPIE Photomask Technology & EUV Lithography conference during which Intel Foundry and ASML shared details of key technical breakthroughs in their journey to the commercialization of High Numerical Aperture (High-NA) Extreme Ultraviolet (EUV) lithography technology.
With the help of tool qualification, research & development testing and high volume production, the two organizations have successfully crossed the one million mark of wafers produced via the High-NA EUV technology.
Driving High-Volume Manufacturing and Performance
High-NA EUV lithography is actively deployed across select manufacturing layers within Intel Foundry’s high-volume production lines. Notably, the technology is being utilized for select layers in the production of Intel® Core™ Ultra Series 3 processors, code-named Panther Lake. According to operational metrics, key performance parameters including overlay accuracy, overall wafer throughput, and tool availability are currently aligning with Intel Foundry’s targeted benchmarks.
Additionally, silicon layers fabricated using High-NA technology on the Intel 18A process node are demonstrating performance metrics that equal or exceed those produced via standard 0.33 NA EUV (NXE platform) systems.
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Dual-Path Strategy for Photomask Adoption
To facilitate seamless integration for chip designers, Intel Foundry and ASML are executing a dual-path lithography strategy that balances immediate adoption with future scalability:
- Instantaneous 6-Inch Mask Implementation: Customers of semiconductor products may use High-NA technology in combination with standard 6-inch photomask configurations. This is accomplished either by effective planning of the floor space or by taking advantage of Intel Foundry’s superior reticle stitching technology and Process Design Kits.
- Shift to 6×12-Inch Configuration: In the last three years, Intel Foundry and ASML have been playing leading roles in a collective industry-wide shift towards the use of 6×12-inch large masks. This initiative is a joint collaboration between mask makers, EDA companies, equipment manufacturers, and material suppliers.
Industry Leadership Perspectives
“Intel Foundry has been one of the key leaders of the industry’s adoption of High NA, from installing the first commercial EXE system in 2024, to qualifying the latest generation of tools, to shipping the first high-volume logic product manufactured with High NA,” said Christophe Fouquet, president and CEO, ASML. “ASML recognizes Intel Foundry’s pioneering role in High NA and its innovations to deliver value today with 6-inch masks, as well as its long-time support of the 6×12-inch mask evolution.”
“The companies building the increasingly complex AI products of the future need manufacturing innovations that are production-ready and easy to use,” said Naga Chandrasekaran, Intel Executive Vice President and Co-General Manager of Intel Foundry. “Within our lithography capabilities, Intel Foundry is focused on near term enablement of High NA on 6-inch masks with or without stitching, and making the transition to 6×12-inch masks. We will continue to work closely with ASML and the entire industry to enable this transition.”
